Cu - Interconnects, Glass, and AI - Assisted Simulation for Chiplets and Heterogeneous Integration | 72.84 MB

Title: Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
Author: John Lau, Xuejun Fan
Category: Nonfiction, Science & Nature, Science, Physics, Solid State Physics, Technology, Electronics, Circuits
Language: English | 566 Pages | ISBN: 9789819641666