Lau J Advanced Substrates, Failure Mechanisms, and Thermal Management 2025
Published by : BeMyLove | Views: 0 | Category: E-Books | Date: 6-07-2025, 13:16



Lau J Advanced Substrates, Failure Mechanisms, and Thermal Management 2025 | 74.84 MB

Title: Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author: John Lau · Xuejun Fan




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